XC2V1000

Product Summary

The XC2V1000 is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The XC2V1000 delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15μm / 0.12μm CMOS 8-layer metal process and the XC2V1000 architecture is optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the XC2V1000 enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.

Parametrics

XC2V1000 absolute maximum ratings: (1)Internal supply voltage relative to GND: –0.5 to 1.65 V; (2)Auxiliary supply voltage relative to GND: –0.5 to 4.0 V; (3)Output drivers supply voltage relative to GND: –0.5 to 4.0 V; (4)Key memory battery backup supply: –0.5 to 4.0 V; (5)Input reference voltage: –0.5 to VCCO + 0.5 V; (6)Input voltage relative to GND (user and dedicated I/Os): –0.5 to VCCO + 0.5 V; (7)Voltage applied to 3-state output (user and dedicated I/Os): –0.5 to 4.0 V; (8)Maximum soldering temp.: +220 ℃; (9)Operating junction temperature (2): +125 ℃.

Features

XC2V1000 features: (1)Industry First Platform FPGA Solution; (2)IP-Immersion Architecture; (3)SelectRAM Memory Hierarchy; (4)High-Performance Interfaces to External Memory; (5)Flexible Logic Resources; (6)High-Performance Clock Management Circuitry; (7)Active Interconnect Technology; (8)SelectIO-Ultra Technology; (9)Supported by Xilinx Foundation and Alliance Series Development Systems; (10)SRAM-Based In-System Configuration; (11)0.15 μm 8-Layer Metal Process with 0.12 μm High-Speed Transistors; (12)1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies; (13)IEEE 1149.1 Compatible Boundary-Scan Logic Support; (14)Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm); (15)Wire-Bond BGA Devices Available in Pb-Free Packaging; (16)100% Factory Tested.

Diagrams